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Europe, & Worldwide
 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

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High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China
  Phone: +86 139 5605 4600 
Fax: +86 0551 267 5968
 china@UnitedAdhesives.com 

 

 

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       Dielectric Potting Adhesives

 

United Adhesives Inc. provides various dielectric adhesives for electronic potting applications. They have following features:

-                High dielectric strength for voltage insulations.

-                Soft rubber and flexible to couple thermal stress.

-                Some products provide high thermal conductivity.

-                Some products provide superior high voltage resistance.

They are typically applied to pot or encapsulate parts and cavities, seal lids, covers, housings, connectors, or coat various electronic parts to provide dielectric insulation, vibration dampening, thermal stress coupling, etc.


 

Name

SP4012

SP4018

SP4510

EP1582

EP1642

EP1660

Chemical Base

Silicone

Silicone

Silicone

Epoxy

Epoxy

Epoxy

Features / Advantages

Translucent fluid silicone. Readily flowable. Thermal cure to form firm rubbery dielectric gel. Non-corrosive.

Non-sag (thixotropic) version of SP4012. Dielectric firm rubber.

Addition cure, room temperature

curable, silicone potting rubber.

Transparent epoxy potting or sealing for Opto-Electronic Applications.

High thermal conductivity. High bonding Strength. Low CTE. Easy flow

High voltage resistance. Low arching effect. Strong oil and chemical resistance.

Typical Application

Pot / encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Pot / encapsulate parts & cavities. Seal housings, lids. Coat electronic parts. Vibration dampening Thermal stress coupling

Applying on LED Glob-Top, Optical Lens & IR Lens, Fiber optical, Lens, Prism, Endoscopes or Light Guides, etc.

Potting or sealing for high heat dissipations in electronics.

For high voltage insulation seal or encapsulation. High voltage component bonding or coating.

Rheology

Flowable, Dispensable

Dispensable

Dispensable

Capillary flowable

Flowable

Flowable, Dispensable

Appearance / Color

Translucent

Opaque

Opaque

Transparent

Grey - A
Amber - B

Milky White or Grey

Part / Component

A/B = 1: 1

A/B =1:1

A/B = 1: 1

A/B =1:1

Two parts (1:1)

A/B =1:1

Viscosity @25C (cps, after mixing)

450

31,000

2,000

11,000

160,000

12,000

Pot / Work life (hr)

2 hrs

2 hrs

45 min

60 min

30 min

45 min

Cure Rate

125C 30 min

125C 30 min

RmT 6 hrs
125C 15 min

RmT 8 hr
85C 15 min

85C 120 min
125C 30 min

125C 60 min

Storage

< 25C

< 25C

< 25C

< 25C

< 30C

< 25C

Shelf Life

6 months @ 4C

6 months @ 4C

6 months @ 4C

12 month @ 24C

6 month @ 5C

6month @ 5C

Tg

-120C

-120C

-120C

78

85 to 125

125

CTE (ppm/C)
ASTM D3386-94

< 300

< 300

< 300

< 160 (above Tg)
< 80 (below Tg)

<100(> Tg)
< 30 (<Tg)

120 (above Tg)
60 (below Tg)

Modulus or Hardness

Shore OO = 35

Shore A = 45

Shore A = 30

2.5 Gpa

Shore D = 70

5.6 Gpa

Volume Resistivity
(Ohm-cm)

> 10E14

>10E14

>10E14

>10E12

> 10E+12

> 10E12

Dielectric Strength (V/mil)

> 480 V/mil

> 400 V/mil

450 V/mil

400 V/mil

500 V/mil

> 800

Adhesion
(Al/Al Lap Shear)

N/A

N/A

N/A

> 1600 psi

> 1800 psi

> 1600 psi

Thermal Conductivity (W/mK)

N/A

N/A

N/A

N/A

1.5

N/A

   
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