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Features / Advantages
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High electrical & thermal conductivity.
Strong bonding strength. One component. Strong bonding
strength.
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Flexible epoxy to reduce thermal stress.
High electrical & thermal conductivity.
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Snap cure. High electrical & thermal
conductivity. Very low out-gassing. Strong bonding
strength.
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Flexible epoxy to reduce thermal stress.
Low cost. High electrical & thermal conductivity.
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One part, dispensable and printable.
Low cost. Solvent-free. High thermal stability
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Very high thermal conductivity. Strong
bonding strength. Long room temp pot life
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Typical Application
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For die attach, solder replacement,
chip bonding, lead terminations, printed circuit,
EMI / RFI shielding.
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For die attach, low temp chip bonding,
lower stress conducting bonding applications
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For die attach, solder replacement,
chip bonding, lead terminations, printed circuit,
EMI / RFI shielding.
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Low stress bonding & conducting
in Sensors, Filters, Crystal Oscillators,
MEMS, LCD, Driver IC’s, CCD chip attach, etc.
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For die attach, chip bonding, lead terminations,
printed circuit, EMI / RFI shielding.
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For die attach, solder replacement,
chip bonding, lead terminations, printed circuit,
EMI / RFI shielding.
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