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Europe, & Worldwide
318 Half Day Rd #189
Buffalo Grove, IL 60089, USA

 Phone: +1 (224) 436-0077 
Fax: +1 (630) 621-4198
 sales@UnitedAdhesives.com 

Contact in China and Asia 
High & New Technology
Industrial Development Park
6-1023 Tianzhu Rd.
Hefei City, China

  Phone: +86 139 5605 4600 
 china@UnitedAdhesives.com 

 

 

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Low CTE Epoxy Adhesive - EP1640, EP1641

United Adhesives Inc. makes high performance epoxy adhesives for electronic structural bonding, severe thermal shock and vibration bonding, and media resistance applications. Low CTE (coefficient of thermal expansion) epoxy will allow bonding of electronic components and devices with minimized thermal residual stress in thermal cycles and operations.

Here below are some features:

-                Thixotropic bonding epoxy to anti-sag in processing

-                High Tg formulation for high temperature stability

-                Very low CTE formulation to minimize the thermal mismatch

-                High flow and penetration to fill micro cracks and voids

Some low CTE epoxy adhesives can be used in other industries such as medical / dental applications, and in modern constructions.

Click the name of the adhesive in following Table to access its technical datasheet (TDS) in PDF file.


Name

EP1238

EP1551

EP1635

EP1640

EP1641

EP1660

Features / Advantages

Low viscosity. Fast flow. Room temp curabe; Good adhesion to various substrate

Fast Cure, High Tg, Non-Slumping. Strong bonding to various substances

High Tg formulation for high temperature stability. Strong oil and chemical resistance

Low CTE. Very strong bonding to many plastics and surfaces.  Oil and chemical resistance

Very Low CTE. Flowable epoxy. Strong oil and chemical resistance.

High Voltage resistance. Low arching effect. Strong oil and chemical resistance.

Typical Application

For impregnating, coating, potting Applications. Bond to PBT, PPS, Nylon, PC, Phenolic & other difficult materials.

For die attach, SMT and component attach. Curable in solder reflow process. High thermal stability

For applications that require high temperature stability in semiconductor and automotive electronics such as power devices and processors.

For severe thermal shock, vibration bonding applications. Structural bonding applications. Oil and media resistance applications.

For applications that require extremely low CTE bonding such as silicon / ceramic bonding, ignition coil potting.

For high voltage insulation seal or encapsulation.
High voltage component bonding or coating.

Rheology

Capillary Flow

Thixotropic (non-slump). Dispensable

Flowable, Dispensable

Flow. Good for Potting

Flowable. Dispensable

Flowable, Dispensable

Appearance / Color

Black / Transparent

Off White / Brown

Brown or Grey

Off White or Grey

Milky White Brown Or Grey

Milky White or Grey

Part / Component

A/B = 3: 1

One Part

A/B = 1: 1

A/B = 1: 1

One Part

A/B =1:1

Viscosity @25C
(cps, after mixing)

3,000

26,000

32,000

150,000

25,000

6,000

Pot / Work life (hr)

60 min

6 hrs

24 hrs

60 min

8 hrs

90 min

Cure Rate

RmT 14 hrs
80C 60 min

175C 5 min

150C 15 min
125C 30 min

RmT 12 hr
125C 30 min

125C 45 min

125C 60 min

Storage

< 25C

< -15C

< 25C

< 25C

< – 40C

< 25C

Shelf Life

12 month @ 24C

3 month @ < -15C

6 month @ 24C

6 month @ 24C

> 3 months @ –40C

6month @ 5C

Tg

55

~ 150

165

105

150

125

CTE (ppm/C)
ASTM D3386-94

75 to 125

< 88 (> Tg)
< 25 (< Tg)

< 98 (above Tg)
< 27 (below Tg)

68 (above Tg)
19 (below Tg)

68 (above Tg)
19 (below Tg)

120 (above Tg)
60 (below Tg)

Modulus / Hardness

Shore D = 50

7.8 Gpa

8.5 Gpa

8.5 Gpa

8.9 Gpa

5.6 Gpa

Volume Resistivity
(Ohm-cm)

> 10E12

>10E11

>10E12

>10E12

>10E12

> 10E12

Dielectric Strength (V/mil)

> 500 V/mil

500 V/mil

450 V/mil

500 V/mil

500 V/mil

> 800 VAC/mil

Adhesion
(Al/Al Lap Shear)

> 2500 psi

> 1800 psi

> 1800 psi

> 1800 psi

> 1800 psi

> 1600 psi

 

 
 
 

                

   
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