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Features / Advantages
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Thermally conductive underfill. Capillary
Flow. Dielectric. Low thermal expansion and high Tg.
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Modified with silicone copolymer for
moisture resistance. Good Dielectric. Low current
leakage.
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Low CTE, high Tg underfill. Excellent
thermal stability. Capillary flow. Good Dielectric.
Low current leakage.
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High bonding strength with rubber toughened.
Capillary flow. Strong bond to polyimide, silicone
nitride surfaces.
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Reworkable underfill formulation. Capillary
Flow. Apply heat to lift the BGA / die.
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Soft epoxy encapsulant for thermal stress
release. Capillary flow. Excellent bonding to most
plastic and metal surfaces.
|
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Typical Application
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Semiconductor encapsulant for chip-on-board,
Bare Die, BGA, CSP, etc, that need to good heat dissipation
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For underfill or encapsulation applications
in electronics that require moisture resistance and
strong bonding.
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Underfilling or encapsulating for chip-on-board,
bare die, BGA, flip-chip, CSP,applications that require
low CTE.
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For underfill or encapsulation applications
in electronics that require strong bonding and toughness.
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To underfill components such as chip-on-board,
bare die, BGA, flip-chip, CSP, etc. that require reworkable
capability.
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Low stress bond & flexible underfill.
Bond to PBT, PPS, Nylon, PC, Phenolics and other difficult
materials.
|
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CTE (ppm/C)
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< 80 (above Tg)
23 (below Tg)
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125 (above Tg)
53 (below Tg)
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< 80 (above Tg)
< 20 (below Tg)
|
89 (above Tg)
22 (below Tg)
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< 110 (above Tg)
< 50 (below Tg)
|
115
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