您可点击下面逐个条目查看我们的每个单类产品的目录：

-                保形涂层化合物 (Conformal Coating Compounds)

-                有机硅导电粘合剂 (Electrically Conductive Adhesives)

-                界面和间隙填充导热材料 (Thermal Gap Filling Materials)

-                可流动热固化粘合剂和密封剂 (Heat Cure Adhesives & Sealants - Flowable)

-                不流变热固化粘合剂和密封剂 (Heat Cure Adhesives & Sealants - Non-Sag)

-                常温固化粘合剂和密封剂 (RTV Adhesives and Sealants)

-                导热粘合剂(单组分) (Thermally Conductive Adhesives - One Part)

-                导热粘合剂(双组分) (Thermally Conductive Adhesives - Two Part)

-                电磁干挠的屏蔽和涂层 (EMI Shielding and Coating)

-                环氧树脂导电粘合剂 (Epoxy Based Electrically Conductive Adhesives)

-                高性能环氧树脂粘合剂 (High Performance Epoxy Adhesives)

-                低热膨胀系数型粘合剂 (Low CTE Epoxy Adhesives)

-                特种用途的环氧树脂粘合剂 (Epoxy Adhesives for Special Applications)

-                底部填充与灌装粘合剂 (Underfills and Encapsulants)

-                全氟化涂层 (Perfluoro Coating)

-                全氟化浇灌 (Perfluoro Encapsulation)

-                介电灌装粘合剂 (Dielectric Potting Adhesives)

您可点击此处查看我们的完整的产品目录。 (5 MB)

本公司的粘合剂主要应用于航空、航天， 汽车电子， 计算机， 半导体， 微电子， 电信通讯和现代建筑等工业。联合粘结剂公司注重电子工业中日新月异的技术更新所带来的挑战，从而根据客户的特殊需要，进行专门化的开发和生产。敬请您与本公司的技术支持及相关的服务部们联系：

                     Phone: +1 224 436-0077
                     Fax:         +1 630 621-4198
                     Email: support@UnitedAdhesives.com

关于这些粘合剂在典型的电子器件中是如何应用的，请参考下图：

1. 底部填充或灌装粘合剂 (Underfills and Encapsulants)
2. 导热粘合剂 (Thermally Conductive Adhesives)
3. 电磁干挠的屏蔽和涂层 (EMI Shielding and Coating)
4. 导电粘合剂 或导热粘合剂 (Electrically or Thermally Conductive Adhesives)
5. 不流变热固化粘合剂 或 浇灌 剂 (Non-Sag Adhesives or Gels)
6. 导电粘合剂 (Electrically Conductive Adhesives)
7. 高性能环氧树脂 (High Performance Epoxy)或低热膨胀系数环氧树脂粘合剂 (Low CTE Epoxy)
8. 低热膨胀系数型粘合剂 (Low CTE Adhesives)  
9. 保形涂层化合物 (Conformal Coating) 或全氟化涂层 / 浇灌 (Perfluoro coating or Encapsulation)
10. 特种用途的环氧树脂粘合剂, 例如LED (Epoxy Adhesives for Special Applications)
11. 界面和间隙导热填充材料 (Thermal Gap Filling Materials)
12. 导热粘合剂  (Thermally Conductive Adhesives)
13. 常温固化粘合剂和密封剂或热固化粘合剂和密封剂  (RTV or Heat Cure Adhesives & Sealants)

The descriptions and engineering data shown here have been compiled by United Adhesives Inc. using commonly-accepted procedures, in conjunction with modern testing equipment,and have been compiled as according to the latest factual knowledge in our possession. The information was up-to date on the date this document was printed (latest versions can always be supplied upon request). Although the data is considered accurate, we cannot guarantee accuracy, the results obtained from its use, or any patent infrresulting from its use (unless this is contractually and explicitly agreed in writing, in advance). The data is supplied on the condition that the user shall conduct tests todetermine materials suitability for a particular application.